模組特點(Module Features)

◆20mm像素間距， 16*16模組分辨率、320mm*320mm模組尺寸，燈驅(qū)合一結(jié)構(gòu)，模組輕便、集成度高；

With 20 mm pixel pitch, module resolution of 16*16module size of 320mm*320mm the structure of combined driver board ensures the module light, integration high.

◆超高亮、低衰減、高可靠性、一致性好、高耐候性；

With the features of super brightness, low attenuation, high reliability, good consistency、and high weather ability.

◆模組面罩使整個屏體達(dá)到防塵、防曬、防直接與發(fā)光晶片的碰撞，并能達(dá)到保護(hù)晶片的效果；

With the module cover ensures dust proof, anti-sun, anti-direct collision with the light emitting chip and also can reach the effect of chip protection.

◆模組PCB表面經(jīng)過三防水涂刷，防潮、防水、防腐蝕；

With three water brushing, moisture proof, water proof, anti-corrosion.

◆模組采用PC工程塑料外殼以及環(huán)氧樹脂灌膠防水處理,全密封結(jié)構(gòu)防水等級達(dá)到IP67；

With the adaption of PC engineering plastic and epoxy resin makes the waterproof IP67.

◆全新卡扣底殼結(jié)構(gòu)，安裝拆卸無需擰螺絲，方便拆檢。且后殼上自備兩個提手，攜帶更方便；

With new buckle bottom cover structure, it’s easy for you to install and remove without loosening screws. The behind shell have two handles which makes it more convenient to carry

◆模組上安裝有空中對接防水插頭，無需開殼即可插拔電源線，信號線，安裝使用更安全方便。

The air-water plugs had been installed on module, needn’t to open the shell you can plug the power cord, signal cable, so it’s more safe and convenient to install and use